MediaTek Helio P90 12nm Octa-Core SoC With AI Improvements, Dual 4G VoLTE Announced

    MediaTek has introduced its latest top-end SoC in the P-series – MediaTek Helio P90. This chipset is based on 12nm TSMC FinFET technology, same as the P60 and P70, but this comes with APU 2.0 with fusion AI to enhance the AI experience.

    ALSO READ: MediaTek Helio P70 Vs Snapdragon 660: A Game Of Mid-Ranger Processors!

    MediaTek Helio P90 12nm Octa-Core SoC Introduced

    This chip has two ARM Cortex-A75 2.2 GHz CPUs and six ARM Cortex-A55 2 GHz CPUs. The company promises up to 15% improvement with the newly included IMG PowerVR GM 9446 GPU over the Mali-G72 MP3 used in the Helio P60 and Helio P70.

    MediaTek Helio P90 4

    Furthermore, it supports up to a 48MP camera, 45% larger than 8K resolution – with zero delays, 24+16MP dual rear cameras and has 480fps slow-motion video support. Not just that, It can track and analyze actions and poses of multiple people in real-time. You can use AR avatars, detect multiple objects in a scene or shoot the best low-light.

    MediaTek Helio P90

    It also supports 5-person human pose tracking, Full body avatar AR, 3D pose tracking, Multiple objects, and scene identification, AR/MR acceleration, AI depth engine, Google Lens, ARCore support, Secure and accurate facial recognition.

    MediaTek Helio P90

    This chipset is mainly focused on to AI capabilities. It comes with APU 2.0 with fusion AI to most complex AI apps and tasks while running multiple AI functions at the same time. It generates 1127GMACs for 4.6 times more performance than MediaTek Helio P60 and P70 for performing tasks with a breeze while being extremely power efficient.

    ALSO READ: Qualcomm Snapdragon 855 5G 7nm Mobile Platform With All Around Improvements Announced

    Well, the Helio P70 is now in production and is expected to be available in smartphones in the first half of 2019. According to some reports, the company is in talks with a U.S. mobile brand about using the P90, so we can expect an announcement during MWC in February.


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